Vacuum handling especially for the use in handling silicon wafers
US4744594A · kind A · utility
12Cited by
6References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 10, 1986 |
| Grant date | May 17, 1988 |
| Priority date | — |
| Expiry date | Dec 10, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6838
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The object of this invention relates to the technical sector of microelectronics. The vacuum handling system according to the invention comprises a hollow body (1) of which the end takes the gripping tip forming an inside chamber (1b) with at least two annular grooves (1b1) and (1b2) for the positioning of two O rings (7) of a soft deformable material to insure, on the one hand the dismantable assembling of the part corresponding to the tip, and, on the other hand, the vacuum tightness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.