Method for selectively heating a workpiece subjected to low temperature thermomechanical processing
US4744836A · kind A · utility
16Cited by
2References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 23, 1987 |
| Grant date | May 17, 1988 |
| Priority date | — |
| Expiry date | Jan 23, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Process and apparatus are provided for selective heating a portion of a workpiece to achieve improved ausforming and isoforming processes when the workpiece is plastically deformed by mechanical working above the M.sub.s temperature. The process and apparatus includes a preheating step where a larger portion of the workpiece is preheated to less than the austenitic critical temperature while the final heating step conducted at a temperature higher than the austenitic critical temperature heats a smaller portion of the workpiece which is subsequently subjected to plastic deformation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.