Endoscope using a chip carrier type solid state imaging device
US4745470A · kind A · utility
110Cited by
4References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 3, 1987 |
| Grant date | May 17, 1988 |
| Priority date | — |
| Expiry date | Apr 3, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/555
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solid state imaging device and a substrate to which this solid state imaging device is fitted is contained in the tip part of an endoscope. Conductive parts are formed on at least one side surface of the substrate. The positions of the conductive parts, when that the conductive parts are overlapped with the solid state imaging device, are retreated to be within the electrode positions of the solid state imaging device so that the imaging device may be contained in a small space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.