Method and connecting material for the metallic joining of parts

US4746055A · kind A · utility

Assignee

• Brown, Boveri & Cie AG · DE

Inventors

• Peter Ingram · Hemsbach, DE
• Bernd Jahnke · Neckargemünd, DE
• Arno Neidig · Plankstadt, DE

Key dates

• Filing date: May 22, 1987
• Grant date: May 24, 1988
• Expiry date: May 22, 2007

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/157
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Method for the metallic joining of parts which are formed by semiconductor components with metallization on at least one side or by metallic components or metallic substrates. A composite multilayer material is arranged between the parts to be joined together. Subsequently, the components are joined together at least under the action of defined heat such that only the surface layers directly facing the parts of the composite material are softened.