Patent · US Expired

Method for joining a semiconductor chip to a chip carrier

US4746390A · kind A · utility

7Cited by

7References

6Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Radim Badalec · Munich, DE
Werner Baumgartner
David Cutter · Munich, DE

Key dates

Filing date	Jul 29, 1982
Grant date	May 24, 1988
Priority date	—
Expiry date	Jul 29, 2002

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T156/1002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Method of joining a semiconductor chip to a chip carrier by cementing or soldering which includes treating an area of the semiconductor chip to be joined to the carrier with a laser beam, adjusting the energy of the laser beam to produce depressions by localizing melting of the semiconductor material of the chip and to at least partially pile melted semiconductor material at the edge of the depression, and applying cement or solder between the treated area of the semiconductor chip and the carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.