Magnetron sputtering cathode for vacuum coating apparatus
US4746417A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 15, 1986 |
| Grant date | May 24, 1988 |
| Priority date | — |
| Expiry date | Aug 15, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3455
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A magnetron sputtering cathode for vacuum coating apparatus has a circular target plate and at least one magnet system disposed in back of it which forms at least one endless tunnel of magnetic lines of force over the target plate. In the marginal area of the target plate there is disposed a first magnet system for the production of a first magnetic tunnel substantially concentric with the axis of rotation, and between the axis of rotation and the first magnet system there is an off-center second magnet system which produces a second magnetic tunnel extending over only a sector of the target plate. When the two magnet systems are rotated together the elements of the surface of the target plate are exposed to the product of the time of stay times the intensity such that the target plate is ablated more uniformly in the middle area and more strongly at the margin, so that a substrate field placed opposite the target plate is uniformly coated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.