Method for forming alloy layer upon aluminum alloy substrate by irradiating with a CO.sub.2 laser, on substrate surface, alloy powder containing substance for alloying and silicon or bismuth
US4746540A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 8, 1986 |
| Grant date | May 24, 1988 |
| Priority date | — |
| Expiry date | Aug 8, 2006 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/286
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In this method for forming an alloy layer on the surface of an aluminum alloy substrate, a powder for alloying, containing a substance to be alloyed with the substrate and an element selected from the group consisting of silicon and bismuth, is disposed upon the surface of the aluminum alloy substrate. This powder is then irradiated with a CO.sub.2 laser, so as to be melted and fused together with a surface portion of the aluminum alloy substrate, so that these two are alloyed together. The powder for alloying may be a powder of an alloy of the substance to be alloyed with the aluminum alloy substrate and the element selected from the group consisting of silicon and bismuth, or alternatively may be a mixture of a powder of the substance to be alloyed with the aluminum alloy substrate and a powder of the element selected from the group consisting of silicon and bismuth.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.