Probing apparatus for measuring electrical characteristics of semiconductor device formed on wafer
US4746857A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 2, 1986 |
| Grant date | May 24, 1988 |
| Priority date | — |
| Expiry date | Sep 2, 2006 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2831
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probing apparatus is used to measure electrical characteristics of a semiconductor device formed on a wafer. The apparatus includes means for holding the wafer in a vertical or slightly leaned position on a frame, a contact needle, three-directional drive means for holding the needle on the frame movably both vertically and horizontally along the device-bearing surface of the wafer and for bringing the needle into releasable contact with a desired portion of the device-bearing surface of the wafer, and a microscope provided in such a way that the tip of the needle is seen substantially at the center of the field of view, said microscope being movable together with the needle along the device-bearing surface of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.