Dielectric materials
US4747897A · kind A · utility
34Cited by
2References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 2, 1987 |
| Grant date | May 31, 1988 |
| Priority date | — |
| Expiry date | Apr 2, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0323
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Dielectric materials having low dielectric constant are provided, the materials comprising fabrics impregnated with thermosetting resins, at least a portion of the fibers in the fabrics being fluorocarbon fibers. Also provided is a method of manufacture of these dielectric materials. The dielectric materials are useful in the fabrication of multilayer printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.