Process and composition for sensitizing articles for metallization
US4748056A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 21, 1978 |
| Grant date | May 31, 1988 |
| Priority date | — |
| Expiry date | Feb 21, 1998 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/181
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Non-metallic articles are sensitized for deposition of adherent metal from electroless metal solutions in contact therewith by treatment with a first medium including a compound or combination of compounds containing an element which in one of its states is catalytically active to electroless metal deposition thereby adsorbing on the surface in situ the element(s) and/or compound(s); thereafter treating the surface with a second medium to decrease the solubility of the compound or combination of compounds and/or simultaneously removing the excess; and simultaneously or subsequently, if necessary, treating the surface with one or more agents to transfer said element(s) into a catalytically-active state.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.