Patent · US Expired

Method of bonding structural support channels to a panel and structural building module formed

US4748781A · kind A · utility

25Cited by
5References
17Claims
0Family size

Assignee

Inventor

Key dates

Filing dateOct 22, 1986
Grant dateJun 7, 1988
Priority date
Expiry dateOct 22, 2006

Classification

  • Technology area (CPC E)Fixed Constructions
  • CPC primaryE04C2/386
  • WIPO fieldCivil engineering
  • WIPO sectorOther fields

Abstract

A structural building module and a method of bonding rigid structural support members to a gypsum or fiberboard panel to form a structural building module. The method involves applying a polyurethane adhesive as a liquid by high pressure stream into a space formed at the juncture of the support members and the panel. The space is established by providing a plurality of spaced feet on one planar side of the support members. The support members include either integrally formed feet, which are placed on the panel, or non-integral feet that are inserted between the support members and the panels. The support members may include holes on the surface bonded to the panel in a face to face relationship or on vertical surfaces in close proximity to the panel through which foam may expand and form a mechanical interlock with the support members. The support members may be metal channels or wood members. The structural building module provides an increased strength bonded structure without the use of nails or other fasteners. The film also provides a thermal insulating layer between the structural support members and the panels.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.