Method for bonding ceramic to metal
US4749118A · kind A · utility
10Cited by
3References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 2, 1987 |
| Grant date | Jun 7, 1988 |
| Priority date | — |
| Expiry date | Feb 2, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
When a ceramic is bonded to a metal having a low thermal expansion, if a Cr layer of a Cr diffusion layer is formed on the surface of the metal and the ceramic is bonded to the metal through this Cr layer or Cr diffusion layer by an Al insert, a bonded structure having a good air-tightness and a high strength is obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.