Method for manufacturing monolithic ceramic electronic components
US4749421A · kind A · utility
21Cited by
7References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 1985 |
| Grant date | Jun 7, 1988 |
| Priority date | — |
| Expiry date | Dec 27, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/435
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A plurality of ceramic green sheets each provided with electrodes are prepared and laminated to form a laminated unit. The laminated unit is then vacuum packed in a rubber covering or a synthetic resin sheet. The vacuum packed laminated unit is pressed by hydrostatic pressure within a high-pressure vessel, whereby the plurality of ceramic green sheets are pressed to form a single ceramic sheet, which is then baked to form a chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.