Patent · US Expired

Guide pin assemblies for use in mold presses

US4750876A · kind A · utility

14Cited by
1References
6Claims
0Family size

Assignee

Inventor

Key dates

Filing dateSep 24, 1987
Grant dateJun 14, 1988
Priority date
Expiry dateSep 24, 2007

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S425/01
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A guide pin assembly is described which unidirectional orients mold platens while permitting temperature compensating movement in a perpendicular direction. This is accomplished by using a guide pin and shoe that contact in one direction and permit movement in a perpendicular direction. A bushing containing preloaded bearings is disposed about the guide pin such that the bearings make contact with the shoe to reduce wear and permit the guide pin to slideably contact the shoe.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.