Electrochemical plating of platinum black utilizing ultrasonic agitation
US4750977A · kind A · utility
26Cited by
1References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 17, 1986 |
| Grant date | Jun 14, 1988 |
| Priority date | — |
| Expiry date | Dec 17, 2006 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/20
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Platinum black is electrochemically plated onto a conductive substrate, such as a platinum electrode, by positioning a counter electrode and the conductive substrate in a platinum(IV) ion plating solution. An electric current is passed through the counter electrode, substrate and plating solution for a predetermined period of time. The plating solution and conductive substrate are subjected to ultrasonic agitation while the plating is carried out. The plating solution preferably includes chloroplatinic acid and lead ion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.