Metal plating process
US4751106A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 1986 |
| Grant date | Jun 14, 1988 |
| Priority date | — |
| Expiry date | Sep 25, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/122
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for the formation of a plated through-hole printed circuit board comprising treating a circuit board base material as follows: PA1 1. condition with an oxidant solution; PA1 2(A). contact with a copper etchant that etches copper and neutralizes oxidant residues on the surface to be plated; and PA1 2(B). contact with a conditioner that conditions the board surface for enhanced catalyst adsorption; or PA1 2(A). contact with a neutralizer for oxidant residues that neutralizes said residues and conditions the board surface for enhanced catalyst adsorption; and PA1 2(B). contact with a copper etchant; and PA1 3. catalyze the board; and PA1 4. plate electroless metal onto catalyzed surfaces from a plating solution containing a source of halide ions in a concentration of at least 0.1 moles per liter of solution. The process is characterized by the absence of a step of acceleration and contains fewer processing steps than prior art processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.