Platen arrangement for hot melt ink jet apparatus
US4751528A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 9, 1987 |
| Grant date | Jun 14, 1988 |
| Priority date | — |
| Expiry date | Sep 9, 2007 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J11/02
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
In the particular embodiment described in the specification, a hot melt ink jet system includes a temperature-controlled platen provided with a heater and a thermoelectric cooler electrically connected to a heat pump and a temperature control unit for controlling the operation of the heater and the heat pump to maintain the platen temperature at a desired level. The apparatus also includes a second thermoelectric cooler to solidify hot melt ink in a selected zone more rapidly to avoid offset by a pinch roll coming in contact with the surface of the substrate to which hot melt ink has been applied. An airtight enclosure surrounding the platen is connected to a vacuum pump and has slits adjacent to the platen to hold the substrate in thermal contact with the platen.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.