Method and apparatus for handling semiconductor wafers
US4752180A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 12, 1986 |
| Grant date | Jun 21, 1988 |
| Priority date | — |
| Expiry date | Aug 12, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/136
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for handling semiconductor wafers comprises first and second tables having first and second elastic bases each of which has one surface on which a semiconductor wafer having a mirror surface is mounted with the mirror surface facing up and the other surface, and a plurality of through holes extending from one to the other surfaces thereof, a suction mechanism for reducing pressure in the through holes and chucking the semiconductor wafers to said bases and a projecting mechanism, provided to face the other surface of at least said second base, for urging the other surface to elastically deform said base corresponding thereto, thereby projecting a central portion of said base to project the mirror surface of the semiconductor wafer. The projecting mechanism includes projecting member having a conical end surface which is capable of being brought into contact with the other surface of the second elastic base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.