Pulsed laser microfabrication
US4752455A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 27, 1986 |
| Grant date | Jun 21, 1988 |
| Priority date | — |
| Expiry date | May 27, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68363
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A system and method of pulsed-laser microfabrication wherein a first substrate of transparent material, such as glass, has one or more target materials positioned on a surface, preferably a flat surface, of the substrate. These target materials include a thin film of electrically conductive material--i.e., a conductor or semiconductor--immediately adjacent to the substrate surface. Pulsed laser energy is directed through the transparent substrate onto the conductive film at a sufficient intensity and for a sufficient duration to rapidly vaporize the metal film. The target materials are driven by film vaporization energy and by the reaction thereof against the glass substrate onto the opposing or object surface of a second substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.