Circuit board installation
US4753287A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 22, 1987 |
| Grant date | Jun 28, 1988 |
| Priority date | — |
| Expiry date | Oct 22, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermally conductive module for locally extracting heat from an individual electrical component of a circuit board installation comprises a tubular metal housing of high thermal conductivity closed at one end and having at that end a screw-threaded stud for securing the housing to and in thermal contact with a thermal conductor. A spring-loaded metal piston of high thermal conductivity is slidably mounted in the bore of and protrudes from the housing and has a throughbore extending through and opening into the exposed end face of the piston. A grease-like medium of high thermal conductivity is contained in the closed bore of the housing. When the housing is secured in thermal contact with a thermal conductor and the exposed end face of the piston is brought into thermal contact with an electrical component from which heat is to be extracted, the piston is urged against the action of its associated coil spring and grease-like medium exudes from the throughbore and flows between the exposed end face of the piston and the electrical component to provide an effective thermal contact therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.