Method for heat sealing

US4753708A · kind A · utility

Assignee

• Rohm Co., Ltd. · JP

Inventors

• Gerhard Markert · Ober-Ramstadt, DE
• Horst Pennewiss · Darmstadt, DE
• Waldemar Schleier · Darmstadt, DE
• Reiner Schnee · Darmstadt, DE

Key dates

• Filing date: Apr 6, 1987
• Grant date: Jun 28, 1988
• Expiry date: Apr 6, 2007

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31935
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

A film forming dispersion for the heat sealing of dissimilar substrate said dispersion comprising at least two different types of polymers having different adhesive properties in an organic solvent system, at least one of the polymer types being fully miscible at room temperature with the organic solvent system, both of said two polymer types having an acid number ranging from 0 to 160 mg KOH per gram of polymer, and said dispersion further containing a third graft polymer containing components corresponding to said two different polymer types.