Process for the partial metallization of substrate surfaces

US4753821A · kind A · utility

Assignee

• BAYER HEALTHCARE LLC · DE

Inventors

• Henning Giesecke · Cologne, DE
• Gerhard D. Wolf · Dormagen, DE
• Ulrich von Gizycki · Leverkusen, DE
• Reinhart Matejek · Leverkusen, DE

Key dates

• Filing date: Oct 2, 1987
• Grant date: Jun 28, 1988
• Expiry date: Oct 2, 2007

Classification

• Technology area (CPC G): Physics
• CPC primary: G03C5/58
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A process suitable for the fully additive technique for the electroless partial metallization of substrate surfaces consists in treating the surface with photosensitive silver(I) compounds (e.g. carboxylic acid salts), partially exposing the silver(I) compounds left behind on the surfaces, if necessary intensifying the exposure effect and/or exchanging the silver produced during the exposure for nobler metals, and detaching the unexposed silver(I) compounds.