Heat-resistant methacrylic resin composition
US4753996A · kind A · utility
4Cited by
2References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 7, 1986 |
| Grant date | Jun 28, 1988 |
| Priority date | — |
| Expiry date | Jul 7, 2006 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A transparent heat-resistant methacrylic resin composition comprising 1 to 99% by weight of a copolymer (I) obtained by polymerizing a monomer mixture of 98 to 40% by weight of methyl methacrylate, 1 to 30% by weight of an N-substituted maleimide, and 1 to 30% by weight of an aromatic vinyl monomer and 99 to 1% by weight of a copolymer (II) containing at least 70% by weight of methyl methacrylate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.