Heat resistant molding compounds

US4754008A · kind A · utility

Assignee

• Rohm Co., Ltd. · JP

Inventors

• Werner Siol · Pfungstadt, DE
• Ulrich Terbrack · Reinheim, DE
• Frank Wenzel · Düsseldorf, DE
• Winfried Wunderlich · Roßdorf, DE

Key dates

• Filing date: Apr 6, 1987
• Grant date: Jun 28, 1988
• Expiry date: Apr 6, 2007

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08F220/14
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

A method for making thermostable methyl methacrylate/alpha-methylstyrene copolymers having a high heat distortion temperature and adaptable to use as molding compounds by emulsion polymerization of these monomers together with lower alkyl acrylates and/or styrene, the water phase being less than 70 weight percent of the total monomer/water components and the amount of emulsifier being less than 0.5 weight percent of the water component, the copolymer being isolated by freeze coagulation or extruder pinch-off.