IC card and method for manufacturing the same
US4754319A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Sep 11, 1987 |
| Grant date | Jun 28, 1988 |
| Priority date | — |
| Expiry date | Sep 11, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In an IC card according to the present invention, a base sheet formed of thermoplastic material is sandwiched between a substrate sheet and a dummy sheet both formed of nonplastic material lower in thermoplasticity than the base sheet. The substrate sheet is fitted with at least one IC chip and input/output terminals electrically connected to the IC chip. First and second cover sheets formed of thermoplastic material are put individually on the outer surfaces of the substrate sheet and the dummy sheet. The cover sheet on the substrate sheet is formed with apertures through which the input/output terminals are exposed to the outside.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.