Heat-dissipating socket connector for leaded modules
US4755146A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 4, 1987 |
| Grant date | Jul 5, 1988 |
| Priority date | — |
| Expiry date | Jun 4, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S439/923
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A new and improved heat-dissipating socket connector for connecting individual leads of a leaded module to individual circuits on a printed circuit board comprises a unitary molded dielectric frame including a module-receiving recess. The frame is cantedly mounted on the circuit board with the recess disposed at an angle with respect to the printed board surface. Compliant terminals are mounted in generally open terminal receiving cavities within the frame which are adapted to engage side portions of leads on an inserted module with high contact pressure in an anti-overstress manner. Openings within the frame together with an exposed terminal mounting arrangement, provide ventilation and airflow exposure for portions of the connector and module susceptible to the generation of high temperatures in use. The overall arrangement provides enhanced electrical reliability by reducing the possibilty of heat induced failures. The new and improved socket connector does not require increased board surface area and provides for full visual inspection for solder connections between connector terminals and printed circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.