Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards
US4755271A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 1, 1987 |
| Grant date | Jul 5, 1988 |
| Priority date | — |
| Expiry date | Jun 1, 2007 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/06
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for electroplating plate-shaped workpieces, such as a printed circuit board, having a cell, an arrangement for conducting the workpiece through the cell, and anodes arranged in the cell in contact with the electrolyte solution characterized by an arrangement to cathodically connect the workpiece including at least one tong-shaped contact clamp for gripping the workpiece and arrangement for moving the clamp along with the workpiece, as is conveyed through the cell. Preferably, the arrangement for moving is an endless drive of a continuous member, such as a chain or a plurality of belts, and a plurality of contact clamps are spaced along this member to grip the edge portion of the workpieces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.