Polyimide film having improved adhesive properties
US4755424A · kind A · utility
15Cited by
2References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 20, 1987 |
| Grant date | Jul 5, 1988 |
| Priority date | — |
| Expiry date | Jan 20, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyimide film produced by forming a film from a raw material incorporated with a finely divided inorganic powder that forms minute projections on the film surface and subsequently subjecting the film to corona discharge treatment. According to this invention, it is possible to obtain a heat-resistant polyimide film having improved adhesive properties and uniform bond strength. The film does not cause blocking when wound into a roll.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.