Combined busbar and electrical lead assembly
US4755659A · kind A · utility
27Cited by
5References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 3, 1987 |
| Grant date | Jul 5, 1988 |
| Priority date | — |
| Expiry date | Feb 3, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B2203/016
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electrically conductive substrate having a conductive layer formed on one surface of the substrate, a busbar and electrical lead assembly is adhesively bonded onto the conductive layer with the electrical lead portion of the assembly being connected to an electrical source or ground. The substrate can be used as a window or viewing screen. The conductive layer can be used as a defogger or as a means for dissipating static electricity or errant electrical emissions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.