Multilayer printed circuit board
US4755911A · kind A · utility
53Cited by
10References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 28, 1987 |
| Grant date | Jul 5, 1988 |
| Priority date | — |
| Expiry date | Apr 28, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31544
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer printed circuit board is provided comprising a plurality of printed circuit boards laminated together, each board being separated from an adjacent board by a layer of a dielectric of porous, expanded polytetrafluoroethylene (PTFE). The dielectric layer may have an adhesive on its surface(s) affixed as a layer or in a pattern of dots. Alternatively, an adhesive may be impregnated within the pores of the porous dielectric. In a preferred embodiment, the dielectric has additional openings or through holes in it, in additon to the pores of the porous dielectric.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.