Raw card fabrication process with nickel overplate
US4756795A · kind A · utility
16Cited by
7References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 1986 |
| Grant date | Jul 12, 1988 |
| Priority date | — |
| Expiry date | Oct 31, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24322
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for making printed circuit cards is disclosed wherein a copper clad, insulating substrate having a layer of copper from which circuitry lines and patterns will be fabricated, is coated with a thin layer of nickel prior to forming any circuit patterns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.