Epoxy resin laminating varnish and laminates prepared therefrom
US4756954A · kind A · utility
6Cited by
12References
39Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 1987 |
| Grant date | Jul 12, 1988 |
| Priority date | — |
| Expiry date | May 1, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/3512
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Compositions comprising (A) a halogenated phenoxy resin and (B) an advanced epoxy resin are useful in the preparation of electrical laminates when admixed with a suitable curing agent such as dicyandiamide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.