Apparatus for solder removal
US4757780A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 20, 1986 |
| Grant date | Jul 19, 1988 |
| Priority date | — |
| Expiry date | May 20, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1509
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A vapor phase system for soldering of a workpiece. A vessel for containing an electronic liquid which is heated to generate a zone of saturated vapor. A first inclined throat communicates with the vessel and a solder pot is located within the vessel. The solder pot including a reservoir for containing molten solder, a second throat aligned with the first throat and communicating at one end with molten solder contained in the reservoir means and communicating at the other end with the saturated vapor, molten solder contained in the reservoir means is pumped through the second throat and is captured by the reservoir and a conveyor carries work product through the first throat, through the saturated vapor and into the second throat whereby the work product will become immersed in the molten solder contained within the second throat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.