Thermal protective device with bimetal for semiconductor devices and the like
US4758876A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 15, 1986 |
| Grant date | Jul 19, 1988 |
| Priority date | — |
| Expiry date | Oct 15, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H2037/046
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A thermal protective device for semiconductor devices and the like comprises a housing of electrically insulative plastic material made in cup form having at the open end a seat for lodging a bimetallic disc and means for applying the cup to the semiconductor device with the bimetallic disc in direct heat exchange relation therewith. One or more electric terminals is incorporated in the housing at the time of molding and is connected in power supply circuits of the semiconductor device and/or alarm and signaling circuits. The bimetallic disc acts on said electric terminals so as to interrupt or modify the power supply to the semiconductor device or to actuate an alarm signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.