Patent · US Expired

Apparatus for melting a solder by vapor-phase treatment

US4759710A · kind A · utility

6Cited by

12References

3Claims

0Family size

Assignee

W. C. Heraeus GmbH · DE

Inventors

Andreas Polaczy · Hanau, DE
Werner Simon · Seeheim-Jugenheim, DE

Key dates

Filing date	Mar 9, 1987
Grant date	Jul 26, 1988
Priority date	—
Expiry date	Mar 9, 2007

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K1/015
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

Apparatus for melting by vapor-phase treatment a solder applied to an object. The liquid serving for vapor production, which is situated in a vessel, is heated by electrical heating means which are disposed exclusively outside of the vessel and are completely enveloped by a liquid heat-carrying medium. The vessel floor is provided with projections to increase the thermal transfer. A tubing coil is furthermore disposed in the heat-carrying medium for rapid cooling thereof.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.