Electronic carrier devices and methods of manufacture
US4759970A · kind A · utility
19Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 27, 1987 |
| Grant date | Jul 26, 1988 |
| Priority date | — |
| Expiry date | Apr 27, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/256
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
New chip carrier type devices have a substrate with a particle-loaded ink defining a plurality of distinct circuit paths. The circuit paths carry a conductive metal plating. The ink is designed with binder and adhesive means which are used to firmly attach the ink to the substrate which can be an organic resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.