Patent · US Expired

High impact thermoplastic molding material based on modified polyphenylene ethers, polyoctenylenes and polyamides

US4760115A · kind A · utility

12Cited by

3References

15Claims

0Family size

Assignee

Huls Aktiengesellschaft · DE

Inventors

Michael Droescher · Dorsten, DE
Hans Jadamus · Marl, DE

Key dates

Filing date	Mar 30, 1987
Grant date	Jul 26, 1988
Priority date	—
Expiry date	Mar 30, 2007

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L65/00
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

The invention relates to thermoplastic materials having the following components: PA0 (a) 5-85 parts by weight of a melted or remelted preforming material comprising PA1 (i) 60-98 parts by weight of a polyphenylene ether, PA1 (ii) 40-2 parts by weight of a polyoctenylene, and PA1 (iii) 1-7.5 parts by weight of bicyclo [2.2.2]-2,3:5,6-dibenzooctadiene-2,5-dicarboxylic acid-7,8-anhydride, and PA0 (b) 95-15 parts by weight of a polyamide comprising an aliphatic homopolyamide or a copolyamide and optionally PA0 (c) polystyrene resins, flame protection agents, and other additives, and to a method for their manufacture.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.