Electroplate to moving metal
US4761217A · kind A · utility
11Cited by
1References
12Claims
0Family size
Inventors
Key dates
| Filing date | Mar 17, 1987 |
| Grant date | Aug 2, 1988 |
| Priority date | — |
| Expiry date | Mar 17, 2007 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/0642
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An anodic roller electroplating process utilizes novel anodic roller apparatus and provides flexible operation parameters. The novel anodic roller apparatus comprises a perforate valve metal cylinder such as in mesh form. The cylinder has an electrocatalytic coating and an electrolyte-containing, porous wrap. Processing parameters can provide desirable electroplate, such as of metal coils, at enhanced plating speeds as well as providing carefull control over plate composition and deposition thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.