Method of making a positioned chip surface covering
US4761306A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 30, 1984 |
| Grant date | Aug 2, 1988 |
| Priority date | — |
| Expiry date | Oct 30, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2982
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
The present invention relates to a process for preparing chip-containing decorative surfaces wherein the chips are positioned so as to provide a pattern. A first adhesive material is selectively applied to a support surface and the conditions are adjusted so that the first adhesive material is substantially non-adhesive in nature. A second adhesive material is selectively applied as a pattern on top of or adjacent to the first adhesive material and chips are applied to the surface so as to be adhered by the second adhesive material. Any non-adhered chips are removed and the conditons are adjusted so that the first adhesive material demonstrates adhesive properties. A second type or color of chip material is then applied so as to be adhered by the first adhesive material. Upon removal of the non-adhered chips, a product is obtained having a positioned chip pattern. The process may also be practiced using additional adhesives and chips so as to provide products having more than two types of positioned chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.