Polyamide resin composition
US4761445A · kind A · utility
56Cited by
1References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 15, 1986 |
| Grant date | Aug 2, 1988 |
| Priority date | — |
| Expiry date | Jul 15, 2006 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/54
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The subject invention relates to polytetramethylene adipamide resin compositions containing 100 parts by weight of the polyamide and 2 to 20 parts by weight of a silicon oil. Objects produced from the composition possess good surface appearance, excellent sliding properties and high heat resistance and rigidity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.