Non-contact sensing and controlling of spacing between a depositing tip and each selected depositing location on a substrate
US4762578A · kind A · utility
37Cited by
4References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 28, 1987 |
| Grant date | Aug 9, 1988 |
| Priority date | — |
| Expiry date | Apr 28, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention involves non-contact sensing of a selected location on a substrate at which material is to be deposited, and positioning of a material depositing tip a preferred distance from this location on the substrate according to such sensing and in preparation for the depositing. Preferably, the tip is advanced to a preferred spacing between it and the substrate, without overshooting the spacing and without contacting the substrate, in preparation for depositing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.