Copper bath for electroless plating having excess counter-cation and process using same
US4762601A · kind A · utility
14Cited by
4References
6Claims
0Family size
Assignee
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Key dates
| Filing date | Nov 10, 1986 |
| Grant date | Aug 9, 1988 |
| Priority date | — |
| Expiry date | Nov 10, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S204/13
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroless copper plating bath is improved so as to facilitate its regeneration in an electrodialysis cell. The bath includes elevated amounts of an added salt, preferably as Na salt. The elevated sodium ion level serves as additional counter-cation to hydroxyl ion which is produced at the cathode of the electrodialysis cell. The excess anion from the added salt increases the rate of out-migration of by-products, such as formate ions and sulfate ions, relative to hydroxyl ions through an anion permselective membrane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.