Patent · US Expired

High temperature resistant molding materials

US4762869A · kind A · utility

5Cited by
2References
17Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 16, 1987
Grant dateAug 9, 1988
Priority date
Expiry dateApr 16, 2007

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K1/0333
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

High temperature resistant molding materials containing (A) 5-95 mol % of blocks having the structural unit I ##STR1## (B) 5-95 mol % of blocks having the structural unit II ##STR2## (C) 0-80 mol % of blocks having the structural unit III ##STR3## the molecular weight of the blocks being within the range 2000-20,000, where X is --O--, --S--, ##STR4## (only if a or b.noteq.0), ##STR5## (R.sup.7 =R.sup.8 =CH.sub.3 only if a or b.noteq.O) or a chemical bond, R.sup.7 and R.sup.8 are each alkoxy or alkyl of 1-6 carbon atoms, aryl or hydrogen, Q and W are each ##STR6## Z is --O-- or a chemical bond and R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5 and R.sup.6 are each alkyl or alkoxy of 1-6 carbon atoms, aryl, Cl or F and p, q and r are each 0 or 1 and a, b, c, d and e are each 0, 1, 2, 3 or 4.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.