Soldering apparatus
US4763599A · kind A · utility
1Cited by
7References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 25, 1987 |
| Grant date | Aug 16, 1988 |
| Priority date | — |
| Expiry date | Feb 25, 2007 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K3/0684
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A soldering apparatus includes a solder bath 40 and a component holder 43 positioned to lower an exposed tag of a component to contact solder in the solder bath 40. After removal from the bath the component is deliberately subjected to a mechanical shock when a limb of a bracket 44 strikes a turret plate 42 under the action of a spring 46. The shock causes a short time vibration in the component and spreads solder in tears which naturally form on the exposed tags to remove or substantially reduce those tears.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.