Process for activating substrate surfaces for electroless metallization

US4764401A · kind A · utility

Assignee

• BAYER HEALTHCARE LLC · DE

Inventors

• Kirkor Sirinyan · Bensberg, DE
• Henning Giesecke · Cologne, DE
• Gerhard D. Wolf · Dormagen, DE
• Harold Ebneth · Leverkusen, DE
• Rudolf Merten · Leverkusen, DE

Key dates

• Filing date: Jan 28, 1987
• Grant date: Aug 16, 1988
• Expiry date: Jan 28, 2007

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C23C18/28
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A mild and simple process of activating substrate surfaces for the purpose of currentless metallization comprises using organometallic compounds of elements of the groups 1B and 8 of the Periodic System of Elements whose organic moiety has at least one functional group over and above the groups required for binding the metal are used for activation.