Thermal transfer recording medium having an improved hot-sticking resistance
US4764496A · kind A · utility
3Cited by
1References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 19, 1986 |
| Grant date | Aug 16, 1988 |
| Priority date | — |
| Expiry date | Nov 19, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/261
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A thermal transfer recording medium having an improved hot-sticking resistance which comprises a thermoplastic resin film as a substrate, a thermally transferable ink layer provided on one surface of the film, and a thin layer of an inorganic substance provided on the other surface of the film. The thin layer of the inorganic substance prevents the recording medium from hot-sticking phenomenon, whereby a high speed printing is made possible.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.