Method of making a flexible base plate for printed circuit board
US4765860A · kind A · utility
36Cited by
3References
1Claims
0Family size
Inventors
Key dates
| Filing date | Oct 27, 1987 |
| Grant date | Aug 23, 1988 |
| Priority date | — |
| Expiry date | Oct 27, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/095
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention provides a method for the preparation of a flexible base for printed circuit board of the type formed of lamination of a flexible sheet-like polymeric base and a metal, e.g. copper, foil adhesively bonded to the surface thereof by use of an adhesive, in which the surface of the polymeric base prior to bonding of the metal foil is subjected to exposure to low temperature plasma so that the adhesive bonding strength between the polymeric base and the metal foil can be greatly improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.