Board for printed circuits and processes for manufacturing such printed boards
US4766268A · kind A · utility
18Cited by
7References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 19, 1987 |
| Grant date | Aug 23, 1988 |
| Priority date | — |
| Expiry date | Mar 19, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board, in which the substrate (1) and interconnections (2) are masked by a solder-resistant lacquer mask consisting of two layers of lacquer (4,5), the lands (3) being left unmasked, one layer of lacquer (4), which extends to the edges of the lands (3) and directly masks the substrate (1), is provided at least in the region of the lands (3), and the other layer of lacquer (5) masks the interconnections (2), while leaving the lands (3) unmasked, and extends to the region occupied by the layer of lacquer (4) extending to the edges of the lands (3) the two layers overlapping.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.