Injection molded circuit housing
US4766520A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 1986 |
| Grant date | Aug 23, 1988 |
| Priority date | — |
| Expiry date | Dec 5, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/175
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An injection molded housing for thick film ignition circuitry used in conjunction with automobile or other vehicle engines includes an integral lead frame for providing electrical connections between the circuitry and engine sensors and ignition components. To provide protection against lead frame failure as a result of vibration and thermal stresses encountered in the engine environment, residual stress cracking caused by varying flexure of the lead frame during the manufacturing process is prevented by utilizing a pre-mold base in which the lead frame is placed prior to subsequent encapsulating of both the lead frame and the pre-molded base. The result is a lead-frame housing construction of greater reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.