Solder mounting of electrical contacts
US4767344A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 28, 1987 |
| Grant date | Aug 30, 1988 |
| Priority date | — |
| Expiry date | Sep 28, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49149
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electrical component having an elongated contact element provided with a premeasured bead of solder thereon such that, in reflow operation, it can be joined to a contact on another component. In one embodiment, the solder bead can be formed on the pins of a component adapted for mounting on a printed circuit board. In another embodiment, the solder bead is formed on a finger contact of a plug connector adapted to engage a surface contact on an associated daughter board. For both embodiments, the bead is formed by using a mold which assures that each bead contains a uniform amount of solder. The construction enables mixed technology to be mounted on a printed circuit board with both pin mounted components and surface mounted components to be mounted simultaneously in a reflow operation. The entire process resulting in the novel electrical component and in a device incorporating the novel electrical component is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.